Technical Analysis of Horizontal Copper Deposition Line
Published Time:
2025-12-26
The horizontal copper-plating line is the core equipment for through-hole metallization in PCBs, directly impacting the reliability of electrical interconnections between layers in multilayer boards. Our company’s horizontal copper-plating line has been deeply optimized for high-precision applications such as high-frequency, high-speed boards, high-density interconnect (HDI) boards, and flexible printed circuits (FPCs).
Dimensions: MAX: 630*730mm
MIN: 250*250mm
Board thickness: Flexible board: 0.036–3.2 mm
PCB: 0.05–3.2 mm
Backplane: 0.5–12 mm
Aspect ratio: Through-hole 0.15mm, 20:1
Blind hole: 0.075, 2:1
The 0.5mm spiral waterjet design enables a high drug solution penetration rate and features a unique sleep-slot design, maximizing water and power savings. The factory-designed activation process ensures that the micro-etching solution can be recycled online at a cost of approximately 20%. Additionally, energy-saving pumps and fans across the entire line reduce power consumption by 20%.
This equipment has achieved several technological breakthroughs: First, through sophisticated fluid-dynamic design and intelligent control, it ensures high-speed via-hole and micro-blind-via plating with uniform, dense, and highly adherent chemical copper deposition, effectively preventing defects such as voids inside the vias and uneven plating. Second, the production line boasts exceptional process adaptability, accommodating substrates of varying thicknesses, materials, and aspect ratios. Moreover, an integrated online monitoring and analysis system enables real-time adjustment of plating solution parameters, guaranteeing the stability and consistency of the process window. Thanks to its outstanding precision and control capabilities, this equipment lays a solid foundation for subsequent fine-line fabrication, serving as a crucial prerequisite for achieving high performance and high reliability in advanced PCB products.
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